The semicircular outsole with improved elastomeric material over the previous model provides denser and more elastic cushioning.








The column was reinforced to the semicircular structure of the heel to increase the stability inside and outside the foot, and the outsole durability was improved by improving the bonding method of the top and bottom structure.







The noise generation was mitigated by applying a micropuff pattern to the bottom of the outsole, and the foot shape data obtained through the Fit Better project was applied to adjust the last size to provide a more accurate size. 








The heel padding, which prevents heel slipping with a high-density foam, is designed to be integrated with heel padding and heel tap rings for easy wear.








A double string design that minimizes the left and right movement of Sulpo.








It is a 0.5mm ultra-thin brass film that is thermally bonded on a micro monomesh that is more than twice as ventilated as a regular mesh fabric for a smooth fit.
*The upper material is translucent fabric and is see-through.